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Daniel Siegel Memorial Scholarship

Accepting Applications

About the Scholarship

Opens: 12/1/2024
Closes: 2/15/2025

Daniel Siegel Memorial Scholarship provides financial assistance to undergraduate and graduate student members of the Technical Association of the Pulp and Paper Industry (TAPPI) who are interested in preparing for a career in the pulp and paper industry.

Win up to
$4,000
  • Essay Required: No
  • Need-Based: No
  • Merit-Based: No
  • Website
Requirements
  • This program is open to science and engineering students who are undergraduate or graduate TAPPI student members.
  • Applicants must be able to demonstrate an interest in the technological areas covered by the International Flexible Packaging and Extrusions Division (IFPED) of TAPPI (e.g., packaging, industrial films and laminations, extrusion coatings and laminations, blown and cast films extrusion, sheet extrusion, and printing associated with those areas.
  • Selection is based on the candidates' potential career contributions to the pulp and paper industry; financial need is not considered.

    • Details

    Pursued Degree Level
    Bachelor's Degree, Graduate Degree
    Current Grade
    High School Senior, College Freshman, College Sophomore, College Junior, College Senior
    Location
    • Country: US
    Intended Area of Study
    Engineering, Paper Industry
    Affiliations
    Technical Association of the Pulp and Paper Industry (TAPPI)

    Next Steps